July. 12, 2025
Launch of Next-Generation Dual-Cure Silicone Resin SK-SIUV-509.Powered by an original synergistic mechanism of free-radical UV curing and moisture curing, SK-SIUV-509 solves the shadow area curing challenge in complex structures. With performance rivaling imported products, it offers a high-reliability bonding solution for precision electronics, medical devices, and new energy applications.
I. Technological Breakthrough
1.Designed for 3D component assembly, SK-SIUV-509 addresses incomplete curing issues in corners and deep grooves through a dual-curing mechanism: 30-second UV surface cure combined with moisture curing in shadowed areas.
2.In photovoltaic junction box sealing, it prevents long-term tackiness in shaded zones, ensuring complete curing with no uncured areas.
3.With a viscosity range of 500–1000 mPa·s, the product is compatible with dispensing, spraying, and dip-coating processes.
II. Verified Reliability
▶︎ Passed 1000 cycles of thermal shock from -40 °C to 120 °C
▶︎ Maintains over 90% strength retention after 1000 hours of damp-heat aging
III. Application Examples
1.Optical Sensor Manufacturing
Effectively cures micro-shadow areas in CMOS lens assembly, improving yield to 99.2%.
2.New Energy Vehicle ECU
Meets IP67 conformal coating requirements for 3D circuit boards; passes 85 °C / 85% RH environmental testing.
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